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技术说明:3BHB045647R0001 ABB IGCT 模块 GVC736CE101
2、3BHB018162R0001 ABB IGCT 模块 5SHY4045L0001 相对于IGBT而言,IGCT投放市场的时间较晚,应用也没有IGBT广,技术成熟度应该不如IGBT。
3BHB018162R0001 ABB IGCT 模块 5SHY4045L0001 目前的 IGBT和IGCT开、关损耗都差不多,构成的变频器,效率也差别不大。 要论优势,主要是IGCT的耐压目前比IGBT的耐压高,应用于高压变频器的话使得器件减少。3BHB018162R0001 ABB IGCT 模块 5SHY4045L0001 但是目前的风电变流器都是690V的,IGBT的耐压也就足够了。 IGBT和IGCT,谁是电力电子器件的发展方向?目前学术界正在争论,虽然IGCT出现晚,但至少在目前,还看不出它相对IGBT有什么优势。但也有可能随着技术的发展,两者并驾齐驱,或者都被某种新的器件代替。 与IGCT所对应的是IEGT, IEGT也称为压装式IGBT (PPI). IEGT(Injection Enhanced Gate Transistor)是耐压达4KV以上的IGBT系列电力电子器件,通过采取增强注入的结构实现了低通态电压,使大容量电力电子器件取得了飞跃性的发展。 IEGT具有作为MOS系列电力电子器件的潜在发展前景,具有低损耗、高速动作、高耐压、有源栅驱动智能化等特点,以及采用沟槽结构和多芯片并联而自均流的特性,使其在进一步扩大电流容量方面颇具潜力。另外,通过模块封装方式还可提供众多派生产品,在大、中容量变换器应用中被寄予厚望。 日本东芝开发的IECT利用了“电子注入增强效应”,使之兼有IGBT和GTO两者的优点:低饱和压降,宽安全工作区(吸收回路容量仅为GTO的1/10左右),低栅极驱动功率(比GTO低两个数量级)和较高的工作频率,如图3所示。器件采用平板压接式电极引出结构,可靠性高,性能已经达到4.5KV/1500A的水平。
5SHY4045L0001 3BHB018162R0001 3BHE009681R0101 GVC750BE101
1, 3BHB018162R0001 ABB IGCT module 5SHY4045L0001 IGCT has the characteristics of large current, high blocking voltage, high switching frequency, high reliability, compact structure, low on-off loss, etc., and causes low cost, high yield, and has a good application prospect.
2, 3BHB018162R0001 ABB IGCT module 5SHY4045L0001 Relative to IGBT, IGCT was put on the market later, the application is not as wide as IGBT, and the technology maturity should be less than IGBT.
3BHB018162R0001 ABB IGCT module 5SHY4045L0001 The current IGBT and IGCT on and off losses are similar, and the frequency converter is composed of little difference in efficiency. The main advantage is that the voltage withstand of IGCT is currently higher than that of IGBT, and the device is reduced when applied to high voltage inverters. 3BHB018162R0001 ABB IGCT Module 5SHY4045L0001 But the current wind power converters are 690V, the IGBT voltage is enough. IGBT and IGCT, which is the development direction of power electronic devices? At present, the academic community is arguing that although IGCT appeared late, at least for now, it is not clear what advantages it has over IGBT. However, it is also possible that with the development of technology, the two will go hand in hand, or both will be replaced by some new device. Corresponding to IGCT is IEGT, also known as pressure mounted IGBT (PPI). IEGT(Injection Enhanced Gate Transistor) is an IGBT series of power electronic devices with a voltage of more than 4KV. By adopting the structure of enhanced injection, the low on-state voltage is realized, and the large capacity power electronic devices have achieved rapid development. IEGT has a potential development prospect as a MOS series power electronic device, with low loss, high-speed action, high voltage, intelligent active gate drive and other characteristics, as well as the use of groove structure and multi-chip parallel and self-balancing characteristics, so it has great potential in further expanding the current capacity. In addition, many derivative products can be provided through module packaging, which is expected in large and medium capacity converter applications. IECT, developed by Toshiba in Japan, takes advantage of the “electron injection enhancement effect”, giving it the advantages of both IGBT and GTO: low saturation voltage drop, wide safe working area (absorption loop capacity is only about 1/10 of the GTO), low gate drive power (two orders of magnitude lower than the GTO), and high operating frequency, as shown in Figure 3. The device adopts plate crimped electrode extraction structure, which has high reliability and performance has reached 4.5KV/1500A level.
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