81001-450-53-R A-B IGCT驱动模块电路板

81001-450-53-R集成门极换流晶闸管(IGCT)是由门极换流晶闸管(GCT)与其门极驱动单元通过印刷电路版(PCB)集成在一起构成的一种新型大功率半导体器件.这种特殊的结构,使得IGCT具有开通损耗低,阻断电压高,开关频率高等优点.PCB作为驱动电路与GCT的连接体,其设计水平关系到能否实现门极”硬驱动”,直接影响到IGCT的性能与可靠性.因此,对IGCT驱动电路板布局的研究非常重要.本课题是从控制寄生电感大小和增强电路板散热能力两方面着手,采用三维寄生参数提取软件Q3D Extractor和热分析软件Flotherm分别对寄生电感的提取方法以及电路板散热特性进行研究.

81001-450-53-R在此基础上,提出了通用型IGCT的PCB的设计方案.本文的主要研究内容如下:第一,研究了提取PCB寄生电感的提取方法.分析了影响寄生电感的各种因素,重点对关断电路PCB的不同布局和走线进行了对比分析,确定采用多层布线,表贴封装器件,GCT门极区域大面积铺铜并与关断电路中的MOS管之间并联走线等措施,使关断回路的寄生电感控制在8.8057nH.

81001-450-53-R第二,研究了PCB的散热特性.估算了驱动板上元器件的损耗,利用Flotherm软件对IGCT驱动电路板进行了初步的建模和热仿真.分析了铜层厚度和热过孔对PCB散热的影响,并通过增加铜层厚度以及添加热过孔的方式,使PCB在自然散热条件下的温度显著降低.

81001-450-53-R

81001-450-53-R integrated gate commutated thyristor (IGCT) is a new type of high power semiconductor device which is composed of gate commutated thyristor (GCT) and gate driver unit integrated by printed circuit plate (PCB). This special structure makes IGCT have the advantages of low opening loss, high blocking voltage and high switching frequency. As the connection between the drive circuit and GCT, the design level of PCB is related to whether the gate “hard drive” can be realized, which directly affects the performance and reliability of IGCT. Therefore, it is very important to study the layout of IGCT driver circuit board. This topic is to control the size of parasitic inductance and enhance the heat dissipation capacity of the circuit board, using three-dimensional parasitic parameter extraction software Q3D Extractor and thermal analysis software Flotherm to study the extraction method of parasitic inductance and the heat dissipation characteristics of the circuit board.

81001-450-53-R On the basis of this, the design scheme of universal IGCT PCB is proposed. The main contents of this paper are as follows: First, the extraction method of PCB parasitic inductance is studied. Various factors affecting the parasitic inductance are analyzed, and the different layout and routing of the turn-off circuit PCB are compared and analyzed. It is determined that the parasitic inductance of the turn-off circuit is controlled at 8.8057nH by adopting multi-layer wiring, surface mounting device, large area copper placement in GCT gate area and parallel wiring between the MOS tube in the turn-off circuit.

81001-450-53-R Second, the heat dissipation characteristics of the PCB were studied. The loss of the components on the driver board is estimated, and the initial modeling and thermal simulation of the IGCT driver board are carried out by Flotherm software. The influence of copper layer thickness and thermal hole on PCB heat dissipation was analyzed, and the temperature of PCB under natural heat dissipation condition was significantly reduced by increasing the thickness of copper layer and adding thermal hole.