853-045677-105 LAM 电路板控制卡模块

产品细节：853-045677-105 LAM 电路板控制卡模块

电路板可称为印刷线路板或印刷电路板，英文名称为（PrintedCircuitBoard）PCB、（FlexiblePrintedCircuitboard）FPC线路板（FPC线路板又称柔性线路板柔性电路板是以聚酰亚胺或聚酯薄膜为基材制成的一种具有高度可靠性，绝佳的可挠性印刷电路板。具有配线密度高、重量轻、厚度薄、弯折性好的特点。）和软硬结合板（reechas，SoftandhardcombinaTIonplate）-FPC与PCB的诞生与发展，催生了软硬结合板这一新产品。因此，软硬结合板，就是柔性线路板与硬性线路板，经过压合等工序，按相关工艺要求组合在一起，形成的具有FPC特性与PCB特性的线路板。

电路板的分类

线路板按层数来分的话分为单面板，双面板，和多层线路板三个大的分类。

首先是单面板，在基本的PCB上，零件集中在其中一面，导线则集中在另一面上。因为导线只出现在其中一面，所以就称这种PCB叫作单面线路板。单面板通常制作简单，造价低，但是缺点是无法应用于太复杂的产品上。

双面板是单面板的延伸，当单层布线不能满足电子产品的需要时，就要使用双面板了。双面都有覆铜有走线，并且可以通过过孔来导通两层之间的线路，使之形成所需要的网络连接。

多层板是指具有三层以上的导电图形层与其间的绝缘材料以相隔层压而成，且其间导电图形按要求互连的印制板。多层线路板是电子信息技术向高速度、多功能、大容量、小体积、薄型化、轻量化方向发展的产物。

线路板按特性来分的话分为软板（FPC），硬板（PCB），软硬结合板（FPCB）。

电路板的结构

电路板主要由焊盘、过孔、安装孔、导线、元器件、接插件、填充、电气边界等组成，各组成部分的主要功能如下：

焊盘：用于焊接元器件引脚的金属孔。

过孔：有金属过孔和非金属过孔，其中金属过孔用于连接各层之间元器件引脚。

安装孔：用于固定电路板。

导线：用于连接元器件引脚的电气网络铜膜。

接插件：用于电路板之间连接的元器件。

填充：用于地线网络的敷铜，可以有效的减小阻抗。

电气边界：用于确定电路板的尺寸，所有电路板上的元器件都不能超过该边界。

853-049542-173

Circuit boards may be called printed circuit boards or printed circuit boards, English name for the PrintedCircuitBoard (PCB), (FlexiblePrintedCircuitboard) FPC circuit board (FPC circuit board is also called the flexible PCB flexible circuit board based on polyimide or polyester film base material made of a kind of highly reliability, Excellent flexible printed circuit board. It has the characteristics of high wiring density, light weight, thin thickness and good bending. Combined with hard and soft board (reechas SoftandhardcombinaTIonplate) – with birth and development of PCB, FPC plate led to the soft hard couple, this new product. Therefore, the combination of soft and hard board, is the flexible circuit board and hard circuit board, after pressing and other processes, according to the relevant process requirements combined together, the formation of a circuit board with FPC characteristics and PCB characteristics.

Classification of circuit boards

Circuit boards according to the number of layers to be divided into single panel, double panel, and multilayer circuit boards three big classification.

The first is the single panel. On a basic PCB, the parts are concentrated on one side and the wires on the other. This type of PCB is called a single-sided circuit board because the wires appear on only one side. Single panels are usually simple and inexpensive to make, but the disadvantage is that they cannot be used on complex products.

Dual panel is an extension of single panel, when single-layer wiring can not meet the needs of electronic products, dual panel will be used. Both sides are covered with copper and have a route, and the line between the two layers can be guided through the hole, so that it forms the required network connection.

The multilayer board refers to a printed board having more than three layers of conductive graphics layers and insulating materials between them, and the conductive graphics between them are interconnected according to requirements. Multilayer circuit board is electronic information technology to high speed, multi-function, large capacity, small volume, thin, lightweight direction of development products.

According to the characteristics of the circuit board to be divided into soft board (FPC), hard board (PCB), soft and hard combined board (FPCB).

Structure of circuit board

The circuit board is mainly composed of welding pad, through hole, mounting hole, wire, components, connectors, filling, electrical boundary, etc. The main functions of each component are as follows:

Pad: Metal hole for welding the pin of a component.

Through holes: there are metal through holes and non-metal through holes, wherein metal through holes are used to connect the pins of components between each layer.

Mounting hole: used to secure the circuit board.

Wire: Electrical network copper film used to connect the pins of a component.

Connector: A component used to connect circuit boards.

Filling: Copper applied to ground wire network can effectively reduce impedance.

Electrical boundary: Used to determine the size of the circuit board. All components on the circuit board must not exceed this boundary.

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