绿芯将于6月14日至16日在上海举行的2023年国际嵌入式展会((embedded world China 2023)，A088展位)展示其高可靠、高耐久性的固态硬盘和存储卡。绿芯的固态存储产品专注于高品质和长寿命周期，针对要求严苛的嵌入式系统设计。
绿芯拥有广泛的固态存储产品组合，其中包括 NANDrive® 球栅阵列(BGA)固态硬盘(eMMC、PATA、SATA)、ArmourDrive® 可插拔式固态硬盘(SATA M.2、mSATA、SATA 2.5″、NVMe M.2)和存储卡(SD/microSD)，以及高容量工业级固态硬盘(SATA2.5″、NVMe U.2)。这些产品拥有异常断电数据保护功能、超强的数据保持力和超高的耐久性。搭配绿芯专有的EnduroSLC®技术的固态硬盘支持高达30万擦写次数，非常适合工作在极端工作环境中的写密集型应用。
请移步绿芯半导体位于A088展位，技术人员将在现场解答绿芯的固态硬盘和存储卡 (https://www.greenliant.com/products) 如何满足工业、汽车和交通运输等应用对数据存储的严苛要求。
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Greencore will showcase its highly reliable and durable solid-state drives and memory cards at embedded world China 2023 (Booth A088) in Shanghai from June 14 to 16. Greencore’s solid-state storage products focus on high quality and long life cycle, designed for highly demanding embedded systems.
Greencore has an extensive solid state storage product portfolio, These include NANDrive® Ball Grid Array (BGA) solid-state drives (eMMC, PATA, SATA), ArmourDrive® swappable solid-state drives (SATA M.2, mSATA, SATA 2.5″, NVMe M.2), and memory cards (SD/microSD), And high capacity industrial-grade solid-state drives (SATA2.5″, NVMe U.2). These products have abnormal power failure data protection, super data retention and super durability. Combined with Greencore’s proprietary EnduroSLC® technology, the SSD EnduroslC ® technology supports up to 300,000 erase times and is well suited for writing-intensive applications that work in extreme work environments.
Semiconductor located in A088 booth, please click the green core technical personnel will be on the scene to solve the green core solid-state hard disk and memory card (https://www.greenliant.com/products) how to meet the industrial, automotive and transportation applications demanding requirements for data storage.
